Description
The Die / Wire Inspection Handler is an advanced automated solution designed for high-precision inspection and handling of substrates, lead frames, and semiconductor dies. Engineered for modern semiconductor and electronic assembly environments, the system combines accurate mechanical positioning with intelligent vision inspection to deliver reliable and efficient quality control.
Equipped with a high-resolution X-Y table and multiple inspection stations, the system supports comprehensive inspection processes including die-attach inspection, defect detection and classification, and substrate mapping. These capabilities enable fast, repeatable inspections while maintaining tight accuracy requirements across high-volume production lines.
